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What are the applications of encapsulation vacuum defoaming and solidification assembly line in the

source:8678g.com  |  Release time:2025年08月06日
       The encapsulation vacuum defoaming and solidification assembly line is mainly used in the packaging of "three electric systems" and related electronic components in the new energy vehicle industry to improve product performance and reliability. The specific applications are as follows:
1. Battery pack packaging: New energy vehicle battery modules need to be sealed to achieve waterproof, dustproof, earthquake resistant, and thermal insulation functions. The vacuum defoaming and solidification assembly line for encapsulation can correctly encapsulate high-temperature resistant, flame-retardant, and insulating colloids into battery modules, avoiding the problem of uneven thickness caused by manual operation and reducing the risk of battery thermal runaway. Meanwhile, through vacuum defoaming technology, bubbles in the gel can be eliminated, ensuring a tight fit between the gel and battery components, and improving the heat dissipation and electrical insulation performance of the battery pack.
2. Sealing of motor controller: The motor controller is the control core of new energy vehicle motors, and its working environment is complex, requiring good waterproof, dustproof, and heat dissipation performance. The vacuum degassing and solidification assembly line for sealing can seal the motor controller to achieve an IP68 waterproof rating, ensuring stable operation in high vibration and wide temperature range environments.
3. IGBT module encapsulation: IGBT modules are the core components for energy conversion and transmission in new energy vehicles. The encapsulation vacuum defoaming curing assembly line can fill thermal conductive silicone into the power module in a vacuum environment, improving heat dissipation efficiency and insulation, ensuring effective heat dissipation of IGBT modules during operation, and improving their reliability and service life.
4. Battery Management System (BMS) circuit board encapsulation: The BMS circuit board is responsible for monitoring and managing the working status of the battery pack, and needs to have good waterproof performance to adapt to humid and vibrating working environments. The encapsulation vacuum defoaming curing assembly line effectively prevents moisture and humidity from entering the BMS circuit board by vacuum gluing, protecting the electronic components on the circuit board and ensuring the stable operation of the BMS system.
5. Casting of in car EVC capacitors: During the production process of in car EVC capacitors, the filling and vacuum defoaming curing assembly line can automatically manage and control the processes of preheating, material preparation casting, primary curing, adhesive surface detection, precision adhesive repair, secondary curing, post curing, online aging, discharge cooling, etc., to achieve automated production, improve production efficiency and product qualification rate.
6. Sensor packaging: Various sensors in new energy vehicles, such as temperature sensors, pressure sensors, etc., need to be sealed to protect internal components, improve their anti-interference ability and reliability. The sealing vacuum defoaming curing assembly line can evenly seal the glue into the sensor housing, ensuring that the sensor can work stably in various environments.
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